IEC-61837-2-2000 pdf free download – Surface mounted piezoelectric devices for frequency control and selection – Standard outlines and terminal lead connections – Part 2: Ceramic enclosures.
This part of lEC 61837 deals with standard outlines and terminal lead connections as theyapply to SMDs for frequency control and selection in ceramic enclosures,and is based onlEc 61240.
2Normative references
The following normative documents contain provisions which，through reference in this text,constitute provisions of this part of lEC 61837.For dated references，subsequent amend-ments to，or revisions of，any of these publications do not apply. However，parties toagreements based on this part of lEC 61837 are encouraged to investigate the possibility ofapplying the most recent editions of the normative documents indicated below.For undatedreferences, the latest edition of the normative document referred to applies.Members of lECand lSo maintain registers of currently valid lnternational Standards.
IEC 61240:1994，Piezoelectric devices – Preparation of outline drawings of surface-mounteddevices (SMD) for frequency control and selection -General rules
3 Configuration of enclosures
The enclosures of surface-mounted devices are made of ceramic materials with the terminalsof deposited metal film (leadless type) based on Descriptive designation system forsemiconductors – Devices package.
The configuration symbols are as shown below.
– DcC (dual chip carrier);
– occ (quad chip carrier).
4 Designation of types
The designation of types is shown on the four parts as follows:
A – B C / D D’
A: Configuration symbol of enclosures:
– DCC (dual chip carrier);
– QCC (quad chip carrier).
B: Structure of terminal leads: leadless type has no mark.
C: Number of terminal leads.
D: Serial number of both figures.
5 Ceramic enclosure dimensions
The dimensions given in this standard apply to all completed SMD-devices for frequencycontrol and selection.Only those dimensions are given which meet the requirements oflEC 61240.
6 Lead connections
Recommendations for the lead connections of all completed SMD-devices for frequencycontrol and selection are given in the following individual sheets.Lead connections shallalways be given in the detail specification.
7 Designation of ceramic enclosures
The following table sets out the designation of the ceramic enclosures,as outlined in theensuing specification sheets.IEC-61837-2 pdf download.