IEC-60317-35-2000 pdf free download – Specifications for particular types of winding wires – Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
This part of lEC 60317 specifies the requirements of solderable enamelled round copperwinding wire of class 155 with a dual coating.The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the originalresin and meets all specified wire requirements. The superimposed coating is a bonding layerbased on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives toenhance certain performance or application characteristics.
Class 155 is a thermal class that requires a minimum temperature index of 155 and a heatshock temperature of at least 175 c.
The temperature in degrees Celsius corresponding to the temperature index is not necessarilythat at which it is recommended that the wire be operated and this will depend on manyfactors, including the type of equipment involved.
The range of nominal conductor diameters covered by this standard is:-Grade 1B: 0,020 mm up to and including 0,8o0 mm;
-Grade 2B: 0,020 mm up to and including 0,800 mm.
The nominal conductor diameters are specified in clause 4 of lEC 60317-O-1.
2Normative references
The following normative documents contain provisions which，through reference in this text,constitute provisions of this part of lEC 60317.For dated references,subsequent amend-ments to, or revisions of，any of these publications do not apply. However，parties toagreements based on this part of lEC 60317 are encouraged to investigate the possibility ofapplying the most recent editions of the normative documents indicated below.For undatedreferences, the latest edition of the normative document referred to applies. Members of lECand lSO maintain registers of currently valid International Standards.
IEC 60317-O-1:1990，Specifications for particular types of winding wires – Part 0: Generalrequirements – Section’ 1: Enamelled round copper wire.
3 Definitions and general notes on methods of test
For definitions and general notes on methods of test, see clause 3 of IEC 60317-0-1.
In the case of inconsistencies between IEC 60317-0-1 and this part of IEC 60317, the latter shall prevail.
4 Dimensions
See clause 4 of IEC 60317-0-1.
5 Electrical resistance
See clause 5 of IEC 60317-0-1.
6 Elongation
See clause 6 of IEC 60317-0-1.
7 Springiness
See clause 7 of IEC 60317-0-1.
8 Flexibility and adherence
See clause 8 of IEC 60317-0-1.
9 Heat shock
See clause 9 of IEC 60317-0-1, where the minimum heat shock temperature shall be 175 °C.
10 Cut-through
No failure shall occur within 2 min at 200 °C.
11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and including 0,800 mm)
The wire shall meet the requirements given in table 1.
12 Resistance to solvents
Test inappropriate.
13 Breakdown voltage
See clause 13 of IEC 60317-0-1, where the elevated temperature shall be 155 °C.
14 Continuity of insulation
See clause 14 of IEC 60317-0-1.
15 Temperature index
See clause 15 of IEC 60317-0-1, where the minimum temperature index shall be 155.
The test shall be carried out on a wire having a nominal conductor diameter of 0,800 mm,
grade 2B, unless otherwise agreed between purchaser and supplier.
16 Resistance to refrigerants
Test inappropriate.
17 Solderability
17.1 Nominal conductor diameters up to and including 0,050 mm
The temperature of the solder bath shall be 390 C ± 5 ℃.The maximum immersion timeshall be 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.17.2 Nominal conductor diameters over 0,050 mm up to and including o,100 mm
The temperature of the solder bath shall be 390 C ± 5 C. The maximum immersion timeshall be 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.17.3 Nominal conductor diameter over 0,100 mm
The temperature of the solder bath shall be (390 ± 5)C. The maximum immersion time (inseconds)shall be the following multiple of the nominal conductor diameter (in millimetres)with a minimum of 2 s.IEC-60317-35 pdf download.