ANSI SP27.1-2018 pdf free download – For the Recommended Information Flow for Potential EOS Issues between Automotive OEM, Tier 1, and Semiconductor Manufacturers.
4.2.2.1 General lnformation
The general information for level 1B is the same as for level 1A(see Section 4.1.2.1).
4.2.2.2 Process Data
Detailed information should be provided about the application board, such as what type of loadshave been used during EOL testing, or whether the module/PCBA was partially populated duringelectrical testing.
4.2.2.3 Look Across
Details should be provided, such as whether the same electronic component is used on othermodules, on other platforms and/or in other plants without any problems.
4.2.3 Level 1B – Information Provided by the Semiconductor Manufacturer4.2.3.1 General lnformation
More physical failure analysis methods should be used to analyze the device depending on thecondition of the sample in order to isolate the failing location.
4.2.3.2 Process Data
Information should be provided such as whether there are abnormalities of test and packingequipment (for example, unusual downtime or maintenance of machines), or whether there are testyield anomalies related to this specific damage signature (for example, statistical bin performanceshifts, continuity/shorts, and open shifts exist).
4.2.3.3 Look Across
The semiconductor manufacturer should check things，such as whether the same damagesignature (especially on the same pin or in the same block of the semiconductor device) was seenwith the same part at other users and if the damage signature is already in the internal damagepicture database.
4.3 Level 2 Support
Level 2 support requires substantial effort on all sides and also a clear commitment for acooperation from all parties involved.Only through cooperation by all parties will it be possible tohave a chance for finding the root cause for the damage and to avoid similar issues in the future.The information listed in the paragraphs below is in addition to the information provided in levels1A and 1B.
4.3.1 Level 2 – Information Provided by the OEM
For the systemic issues of level 2, the OEM should provide even more information than in level 1B.Such information is described in the paragraphs below and again split into three categories.
4.3.1.1 General Information
Here the OEM should provide information such as the relevant system level schematics regardinghow the module is used in the vehicle:
. What are the actual loads used with this module in the affected vehicle (for example, is thereany circuitry (RC-networks, clamps, etc.) used at the input/output and if yes,what type)?
What ground path is used for the suspected module in vehicle? lt is important to know how thegrounding of the module is accomplished.
o Via the cable harness directly to the battery (“clean ground”)?
o Directly to the battery with inductive loads on the harness?
o Via the metal chassis (“dirty ground”)?
• What modules are connected to each other, for example, is a motor connected to the suspected module or any other module?
• In what system operating conditions was the module/vehicle when the damage happened?
• Did the damage happen during a new launch of a vehicle or was the vehicle in production for some time?
• Was the affected module assembled/tested/used in a third-party operation in the value stream (for example, was the module for a window lifter integrated into the door at a different tier)?
4.3.1 .2 Process Data
Systematic damage can happen during the final assembly of the vehicle. Therefore, it is important to get a detailed description and review of the build process of the affected vehicles. For example:
• The repair history of the vehicle: was any repair work done on the vehicle that other vehicles have not experienced?
• Specific information of the damage: did other modules in the vehicle fail as well?
• Detailed information on how the damaged module was transported, handled, and evaluated at the vehicle manufacturer. For example, was there:
o Any electrical test at the OEM side?
o Any malfunction on the connector?
o Any chattering contacts or faulty components?ANSI SP27.1 pdf download.